We are pleased to inform that our company has reached an agreement for partnership with the company Colnatec.
PhotonExport and Colnatec will be closely working on quartz thin-films monitors’ equipment.
Some of the products we will offer are:
You can check them on our page.
Colnatec is a company launched in 2009, aiming in establishing new industries standards in design, development, and manufacturing of innovative, high-performance sensors and electronic instrumentation used in many areas:
- Atomic Layer Deposition (ALD)
- Solar cell manufacturing (CIGS)
- Mobile display (OLED)
- Optical Coatings (PVD)
- Food packaging (R2R)
- High speed electrical devices (MBE)
- Architectural glass (In-Line)
- Semiconductor wafer processing (CVD)
The company also holds various patents, receiving the Department of Energy SBIR Phase I and II awards for a self-cleaning process control sensor to be used in manufacturing CIGS solar cells. Colnatec is also one of about eight winners of the Arizona Commerce Authority Innovation Challenge Grant Program for promoting innovation in the technology sector.
On the occasion of the World Materials Day, one of our partners, SOCIEMAT, will be organizing with the support of the Institute of Ceramics and Glass – CSIC, a conference, in which two talks will be presented by renowned experts and a series of activities related to the awards granted by our partner, Sociemat.
World Materials Day has been celebrated for several years by member societies of FEMS and its objective is to highlight the importance of Materials in our daily life. We hope you find the program attractive and can attend the event.
When: Wednesday, November 8, 2017 ICV CSV C / Kelsen Assembly Hall 5. Cantoblanco, Campus28049, Madrid.
More information can be found on their website: http://sociemat.es
You can download the agenda here: World Materials Day (5 downloads) .
PS. Due to ISO9001 certification audit with Bureau Veritas our usual fast feedback to your queries could be affected on the 6,7 and 8 November.
PhotonExport has signed with the american company, Denton Vacuum, in Munich, a distribution contract for Spain and Portugal for its PVD and sputtering equipment for electronic microscopy sample preparation. We are proud to he partner of an historical player of Physical Vapor Deposition Systems with more than 50 years expertise in PVD and coatings.
The following systems are now in our offer:
- A sputtering system that can be equipped for carbon evaporation
- The DESK V HP is the global standard for electron microscopy sample preparation
BENCHTOP TURBO »
- Versatile full-range low-voltage (resistive) thermal evaporation platform
- Can be configured for high resolution electron microscopy sample preparation
- Thermal Evaporation, DC & RF Sputtering
- High-vacuum gate improves cycle times increasing throughput
- Accommodate larger sample sizes
Yesterday the terrorist attack in Barcelona, at 200 m from our main office and 30 kms from our warehouse, caused several casualties. We express our condolences to the victims. We will carry on with our normal working and personal life without giving in to terror and fear.
Here you can see the events of Photonics and Lasers that will be celebrated during 2017.
During 2017, the following congresses and exhibitions related to Thin Films, Vacuum Processes and New Materials will be held around the world.
Here you will find all the information corresponding to every congresses and exhibitions.
Graphene at the MWC 2017
The Mobile World Congress (MWC) is an annual event held in Barcelona, which brings together
thousands of device manufacturers, vendors, mobile operators, technology providers and tech
enthusiasts from all over the world. It is world’s largest gathering for the mobile industry, this year
event took place from 27 th February to 2 nd February in Fira Gran Via and we could not miss it.
This year main theme was “THE NEXT ELEMENT”. As always, there were new phones announced,
we could also see a flood of Virtual Reality (VR) and Augmented Reality (AR) devices,
announcement and presentation of revolutionary 5G technology, new Nokia 3310 and even
smarter cars. But we find the “NEXT ELEMENT” to be carbon, in particular – graphene.
During last day of the conference there was an all-day- long workshop dedicated to the material re-
invented in 2004 by two professors of University of Manchester (2010 Nobel Prize winners in
Physics). And what’s interesting, one of the speakers was a member of the winning duet,
Mr. Novoselov presented history of the discovery, unique properties of the material together with
other mono-layer materials and its applications. He has also introduced graphene mass production
– chemical vapor deposition (CVD) applicable for photonics, electronics and coatings,
– growth on silicon carbide(SiC) for electronics and RF transistors,
– liquid phase exfoliation for coatings, composited, energy and biological applications,
– molecular assembly for nano-electronics,
– mechanical exfoliation for research and prototyping (interestingly, might be done with
Other speakers gave insights on successful implementations of graphene and its future
applications in photonic devices for telecom and datacom, high-speed data link, wearables,
flexible printed electronics, various sensors and many others. The workshop session ended with
discussion panel and group discussion.
Norbert Filip – Photon Export attendee at MWC2017 Graphene presentation.
The Portuguese Materials Society organizes the XVIII Materials Congress in Aveiro, Portugal, 9th to 12th april MATERIAIS 2017
MATERIAIS 2017 will be hosted by the University of Aveiro.
The conference will put focus on the following areas: Functional Materials, Structural Materials, Processing Technologies to the Caracterization and Modelling.
The preliminary program is:
– Two schools on Advanced Biomaterials (SaBio) and on Advanced Microscopy Techniques that will take place on April 9
– Scientific talks (plenary, keyNote, Invited, regular talks and posters) that will take place, April 10 – 12
– Debate session on Additive Manufacturing, April 11
– Show case of technologies based on scientific development, April 11
– Satellite event on Energy and Materials, April 10
– Commemoration of the 40th anniversary of the Department of Materials and Ceramics Engineering (DEMaC) of the University of Aveiro, April 12 (afternoon).
Thin film technologies are in constant evolution, enabling enhanced functionalities for technologically advanced devices such as:
- microelectronic devices
- wear resistant coatings and triboloy
- optical coatings
- medical implants
- data storage media (e.g., CDs and DVDs)
- flat panel displays
- energy storage systems
- photovoltaic cells
Thin film technology can be applied to different substrate materials such as metals, ceramics or polymers. Thin film are “grown” over substrates materials as glass, silicon, and steel. The deposition process and the material choice allows to improve properties of the substrate, enhanced functionalities
The diverse technologies deposition available allow to deposit over flexible substrate, polymeric, organic or objects with very complex geometrical shapes.
Deposition materials for thin film processes can range from metals and pure elements to more complex compounds, such as oxides, nitrides and polymers. Source materials, in most cases, require high levels of purity to enable the desired functionality of the thin film coating. PhotonExport ensures raw materials comply to the required purity, typical 99,99% but ranging up to 6N or 99,9999% which are often required in Thin Films R&D and scientific applications.
The generally accepted industry definition of a “thin film” layer is one that is thinner than 5 microns. Layers thickness above eight microns is commonly called “thick films.”
The thin film can be form at the atomic or molecular level, a layer at the time (ate the angstrom level) as per the ALD or Atomic Layer Deposition technique. Depositions can occur in the vapor (Chemical Vapor Deposition) or solution state and be based on physical processes (Physical Vapor Deposition) involving high vacuum chambers, or chemical reactions.
According to the application, the substrate and material layer is structure by patterning by lithography and etching and also by multi patterning depositions phases. The device’s construction process, for example for Microelectromechanical systems (MEMs) is completed by finishing and packaging steps (such as assembly) which vary based on the type of device.