Low Pressure Chemical Vapor Deposition Furnaces – LPCVD

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low plasma enhanced chemical vapor deposition
Low Plasma Enhanced Chemical Vapor Deposition

Diffusion, LPCVD and Oxidation, 1 to 4 quartz independent Tubes, Up to 50 wafers per tube. Ideal for process engineering, Tiny Footprint, Manual or Automatic Loading. Form R&D semiconductor application (TUBESTAR) up to industrial semiconductor automatic furnaces: From 50 to 400 wafers per tube , Up to 300 mm wafer, Best in-class Uniformity, Automatic Loading (DF-SERIES)