FEATURES OF RIE -REACTIVE ION ETCHING
Reactive ion etching is a process that removes materials chemically from substrates using ion bombardment.
The main advantages of using this process are that it provides directional etch while being much stronger than isotropic plasma.
One of the many applications of RIE is the manufacturing of large area computer generated holograms (CGH) as well as the etching of masks.It is also useful in processes involving PEVD of Nano-Crystalline Diamond with direct applications on anti-reflective coatings, lens protection, mechanical tool protection (due to high hardness) and catalytic activation.
The systems provided are a large area high density plasma process system or RIE and PECVD and provides independent plasma excitation and RF substrate bias. The system features substrate cooling and substrate heating, face up or face down substrate orientation, automatic vacuum lock for substrate orientation, scalable for different substrate sizes, chamber control temperature and optical emission spectrometer. Different options are available depending on the substrate size.