FEATURES OF RIE ICP ETCHING EQUIPMENT
• Process chemistry adaptability : Fluorinated and/or chlorinated chemistries can be mixed in the process without cross contamination.
• Substrate size versatility : Easily switch between 2, 4, 6, or 8-inch substrates.
• Flexibility in substrate handling/loading : Depending on the demands, direct load, preloaded shuttle, or preloaded shuttle with load-lock are possible.
• Low reactor maintenance : it is designed for contamination-free processing with in-situ plasma cleaning results with a low reactor maintenance.
• Software that gives you control : Modules can be used in either continuous wave plasma processing or pulsed plasma processing.