Sputtering target backing plates, also known as target backing plates or simply backing plates, play a crucial role in the sputtering process, which is a common technique for thin-film deposition. These plates serve as the structural foundation for the sputtering target, which is the material being bombarded and deposited onto a substrate during the sputtering process.
Backing Plate Materials
At PhotonExport, we provide a wide range of sputtering targets made of materials like Titanium, Aluminum, Chromium, Tungsten, and Copper to highly specialized, custom alloy sputtering targets composed of metallic or ceramic materials. These targets can be expertly bonded to plates constructed from Copper, Copper alloys, Molybdenum, or any other suitable material to suit your unique requirements and sizes.
Copper backing plates
Copper is often preferred for its combination of good thermal conductivity.
Molybdenum backing plates
Molybdenum can be utilized when higher melting point and strength are required.
Custom plates
In some specialized applications, custom materials for your plates might be necessary. For instance, in situations where extreme temperatures or corrosive environments are a concern.
The plates for Sputtering targets are a critical component of the sputtering system, as they ensure the stability and efficiency of the thin-film deposition process. Choosing the right material and design is essential to achieve the desired film quality and deposition rate in various applications, such as semiconductor manufacturing, optical coatings, and material research.
