Wafer Polishing Equipment

Explore state-of-the-art Wafer Polishing Equipment at PhotonExport, the official representative in Spain and Portugal.

Wafer Polishing Equipment

Chemical Mechanical Polishing (CMP) Machines for Wafer Polishing

Chemical Mechanical Polishing (CMP) machines are vital tools in the semiconductor industry, playing a crucial role in the fabrication of integrated circuits and other microelectronic devices. These machines are designed to precisely and uniformly polish the surface of silicon wafers, which are the building blocks of modern electronics; and other wafers as well. CMP is essential for achieving the desired flatness, smoothness, and uniformity required for semiconductor devices to function optimally.

Polished wafers
Key Features of the Chemical Mechanical Polishing (CMP) machine

Key Features of Chemical Mechanical Polishing (CMP) Machines for Wafer Polishing:

  • The optimal use of E460 CMP is in the field of research and development application as well as small scale production requirements due to the machine’s flexibility.
  • The Wafer Polishing equipment is designed for polishing and planarization of single wafers with diameters between 1″ to 8″.
  • Suited for research, development, and small-scale production.
  • Manual Loading, Automatic loading (optional).
  • Touchscreen Interface.
  • Slurry pumps: 2 standard and up to 4 can be installed.
  • And much more!

Specifications of E460 Chemical Mechanical Polishing (CMP) Machine:

Width800 mm
Depth1353 mm
Height2000 mm
Weight800 kg
Wafer dimensionsØ 1″-8″
Wafer Polishing Equipment

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