Empowering the Semiconductor Industry
PhotonExport specializes in delivering state-of-the-art semiconductor equipment specifically for the front-end stages of semiconductor manufacturing.
Our comprehensive portfolio encompasses critical processes ranging from Silicon Crystal Ingot Growth to wet processing, Polishing, Advanced Material Deposition and Lithography.
With a commitment to unmatched precision and efficiency, we prioritize ensuring the seamless execution of foundational phases in semiconductor production.
Leveraging strong partnerships with major international manufacturers but with a strong focus on R&D and small production fabs, we bring you the finest equipment and products tailored to meet your unique requirements.
Our Front-End Semiconductor Equipment Portfolio
Silicon Crystal Ingot Growth & Wafer Preparation Solutions
We provide state-of-the-art semiconductor equipment for the initial stages of semiconductor manufacturing, including Silicon Crystal Ingot Growth, Cleaning, and Polishing. This foundational phase ensures that the silicon wafers are prepared with the highest precision, setting the stage for advanced fabrication processes.
We can also supply Chemical Mechanical Polishing Tools (CMP), a vital step in wafer preparation, which involves planarizing and smoothing silicon surfaces through controlled material removal using chemical and mechanical forces, ensuring a flat and uniform surface crucial for lithography and device fabrication.
What types of semiconductor equipment are involved in wafer processing?
The semiconductor equipment used in wafer processing includes:
- Ingot Casting
- Wafer polishing tools
- Chemical Mechanical Polishing (CMP)
- Ion Implantation
- Ion Beam Trimming
Contact us today for our equipment portfolio line up.
Request Wafer Processing Tools infoOxidation Tools
We offer semiconductor tools for both dry and wet oxidation processes, such as furnaces that can range from R&D needs to large scale production.
Oxidation is an important process used in semiconductor manufacturing because it facilitates the growth of a layer of silicon dioxide (SiO2) on the surface of silicon wafers. This SiO2 layer acts as an insulating material, providing electrical isolation between different components or layers of semiconductor devices.
Additionally, it serves as a protective barrier against contaminants and helps to improve the reliability and performance of the semiconductor devices.
What semiconductor equipment is used for semiconductor oxidation processes?
The semiconductor equipment used for semiconductor oxidation processes includes:
- Dry Oxidation
- Wet Oxidation
Precision Post-deposition Processes Equipment
Post-deposition Lithography processes including Cleaning, Developing and Resist Coating, are pivotal in our offerings. These steps are critical for defining the intricate patterns that will form the electronic circuits on the semiconductor devices.
Our semiconductor equipment offerings ensure the highest fidelity in pattern transfer, a key factor in the success of semiconductor manufacturing. Our tools range from fully automatic to semi automatic single-wafer processing and batch processing. Including mask aligners and spin coaters for small desktop projects to small scale production.
What are some Semiconductor equipment for Lithography?
Semiconductor equipment for lithography processes can include:
- Coating Developing Cleaning Tools
- Fully automatic single-wafer processing equipment
- Semiautomatic single-wafer processing
- Automatic HMDS batch processing
- Spin Coating
- Spray Coating
- Mask Aligners and Exposure equipment
Etching and cleaning Equipment
To further refine the semiconductor wafers and prepare them for the final stages of device fabrication, we offer solutions for Detailed Etching (both Wet and Dry), wafer rinsing with batch spray systems, and RIE, RIE ICP and ion beam milling equipment. These processes are designed to precisely shape the material layers, activate dopants, and remove any undesired materials or residues, ensuring optimal device performance.
What types of semiconductor equipment are included in etching and cleaning processes?
Some semiconductor equipment used for etching and cleaning processes include:
- Wet Etching
- Batch spray systems
- Dry Etching
- Plasma Etching
- Ion Beam Reactive Ion Beam Etching (RIBE)
- RIE ICP (Reactive Ion Etching with Inductively Coupled Plasma)
- Deep Silicon Etching
Advanced Material Deposition and Modification Tools
Our semiconductor equipment portfolio extends to Advanced Material Deposition and Modification, encompassing a broad range of technologies such as, ALD (Atomic Layer Deposition), PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), LPCVD (Low Pressure Chemical Vapor Deposition), PECVD (Plasma-Enhanced Chemical Vapor Deposition), RTCVD (Rapid Thermal Chemical Vapor Deposition), and ICP CVD (Inductively Coupled Plasma Chemical Vapor Deposition), combined ALD/PVD.
We also supply Annealing and RTP (Rapid Thermal Processing) tools, and DLI CVD (Direct Liquid Injection Chemical Vapor Deposition)/DLI ALD machines.
These processes are crucial for applying various materials onto the wafer, enabling the creation of complex semiconductor devices with precise electrical properties.
What types of some Semiconductor Equipment are included in Deposition techniques?
Semiconductor equipment for deposition techniques can include:
- Chemical Vapor Deposition (CVD) Tools
- CVD
- PECVD
- LPCVD
- DLI CVD
- RTCVD
- ICP CVD
- Combined ALD/PVD solutions
- Physical Vapor Deposition (PVD) Tools
- Cluster PVD
- Magnetron Sputtering
- Evaporation
- Electron Beam Evaporation
- Ion-Beam Sputtering
- PLD
- Atomic Layer Deposition (ALD) equipment
- ALD
- DLI ALD
- PEALD
Gas Abatement Systems and Handling Equipment
We also offer gas abatement systems for during/after process exhaust gasses. Gas abatement involves removing harmful or unwanted gases generated during semiconductor manufacturing processes to ensure a safe working environment and comply with environmental regulations. Additionally, we provide handling equipment like gloveboxes and measurement tools for gas concentration and thin film thickness.
Gas Abatement Systems and handling and measurements tools:
- Handling equipment
- Measurement
- Helium Concentration
- Film Thickness
- Gas Abatement
- Plasma
- Thermal
- Wet
- Thermal-wet
- Handling
- Gloveboxes
Thermal Processing Solutions:
Additionally, PhotonExport can supply cutting-edge Thermal Processing solutions.
Our lineup includes Rapid Thermal Processing (RTP) and Rapid Thermal Annealing (RTA) tools, designed to meet the demanding requirements of modern semiconductor fabrication.
These tools enable precise control over temperature profiles and annealing processes, ensuring optimal material properties and device performance.
With PhotonExport’s Thermal Processing solutions, you can achieve superior results and drive innovation in semiconductor technology.
Semiconductor Equipment for Thermal Processing Solutions:
- Rapid Thermal Processing (RTP)
- Rapid Thermal Annealing (RTA)
PhotonExport is your trusted supplier in the semiconductor industry
Designed for flexibility, our semiconductor equipment solutions scale from R&D to industrial production, ensuring your facility can meet the demands of modern semiconductor manufacturing with confidence.
Contact us today for your tailored solution, our team will be happy to assist you.
Contact PhotonExport Today!What Sets Us Apart
PhotonExport stands out with our partnerships with leading semiconductor equipment manufacturers worldwide. Our comprehensive PVD material solutions and substrates selection, from lab to industry scale, are developed to meet the stringent requirements of high-tech applications, ensuring superior performance and purity.
Take the Next Step: Get your semiconductor equipment quote today!
Discover how PhotonExport can transform your semiconductor projects. With equipment selling locally in Spain and Portugal, we’re here to advance your innovations.