Explore state-of-the-art Wafer Polishing Equipment at PhotonExport, the official representative in Spain and Portugal.
Wafer Polishing Equipment
Chemical Mechanical Polishing (CMP) Machines for Wafer Polishing
Chemical Mechanical Polishing (CMP) machines are vital tools in the semiconductor industry, playing a crucial role in the fabrication of integrated circuits and other microelectronic devices. These machines are designed to precisely and uniformly polish the surface of silicon wafers, which are the building blocks of modern electronics; and other wafers as well. CMP is essential for achieving the desired flatness, smoothness, and uniformity required for semiconductor devices to function optimally.
Key Features of Chemical Mechanical Polishing (CMP) Machines for Wafer Polishing:
- The optimal use of E460 CMP is in the field of research and development application as well as small scale production requirements due to the machine’s flexibility.
- The Wafer Polishing equipment is designed for polishing and planarization of single wafers with diameters between 1″ to 8″.
- Suited for research, development, and small-scale production.
- Manual Loading, Automatic loading (optional).
- Touchscreen Interface.
- Slurry pumps: 2 standard and up to 4 can be installed.
- And much more!
Specifications of E460 Chemical Mechanical Polishing (CMP) Machine:
| Dimensions | |
| Width | 800 mm |
| Depth | 1353 mm |
| Height | 2000 mm |
| Weight | 800 kg |
| Wafer dimensions | Ø 1″-8″ |
